Mechanical treatment of silicon and other hard-brittle materials

We have the latest equipment for mechanical processing for silicon and other hard-brittle materials:

• Sawing with precise diamond disk and diamond band saws
• Crushing with jaw crusher technology in the size range from 10 mm to 30 mm
• Low contamination and low abrasion crushing in the size range from 5 mm to 35 mm
• Milling (target particle size from 0,05 mm to 3 mm)
• Processing of multi- and monocrystalline silicon sections (off-cuts) with customer-specific target particle sizes
• Sandblasting of silicon materials like pot scrap and carbon ends, blasting of others materials (for example blasting of metal sheets)